Wafer Cleaving

Optical
Thin Film
Innovation

An IS09001:2008 & British Standard Kitemark company

Wafer Cleaving

Helia Photonics has the equipment & experience to process your devices (e.g. diode lasers, optical detectors, etc.) pre and post thin film deposition.

• Vision assisted semi-automatic wafer to bar & bar to die cleave
 
• Fully automatic 2D chip scribe & break
 
• Low transfer tape – zero contamination
 
• Custom diamond tools for demanding applications
 
• Processes for GaAs, Si, Ge, InP & glass wafers